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Chapter 1
Rev. 2016, 116 (18), 11061–11127.
(33) Ostrikov, K. Rev. Mod. Phys. 2005, 77 (2), 489–511.
(34) Lin, L.; Wang, Q. Plasma Chem. Plasma Process. 2015, 35 (6), 925–962.
(35) A Fridman, A Chirokov, A. G. J. Phys. D. Appl. Phys. 2005, 38, R1–R24.
(36) Fridman, A. A. Plasma Chemistry; Cambridge university press, 2008.
(37) Grasso, S.; Poetschke, J.; Richter, V.; Maizza, G.; Sakka, Y.; Reece, M. J. J. Am. Ceram. Soc. 2013, 96 (6), 1702–1705.
(38) Tong, L.; Reddy, R. G. Scr. Mater. 2005, 52 (12), 1253–1258.
(39) Yang, Y. F.; Wang, H. Y.; Zhao, R. Y.; Liang, Y. H.; Jiang, Q. C. Int. J. Refract. Met. Hard Mater. 2008, 26 (2), 77–83.
(40) Rizk, S.; Assouar, M. B.; Belmahi, M.; Le Brizoual, L.; Bougdira, J. Phys. Status Solidi a- Applications Mater. Sci. 2007, 204 (9), 3085–3090.
(41) Leconte, Y.; Leparoux, M.; Portier, X.; Herlin-Boime, N. Plasma Chem. Plasma Process. 2008, 28 (2), 233–248.
(42) Tavares, J.; Coulombe, S.; Meunier, J.-L. J. Phys. D. Appl. Phys. 2009, 42 (10), 102001.
(43) Bora, B.; Aomoa, N.; Kakati, M.; Bhuyan, H. Powder Technol. 2013, 246, 413–418.
(44) Rutkowski, P. J.; Kata, D. J. Adv. Ceram. 2013, 2 (2), 180–184.
(45) Kim, D.-W.; Kim, T.-H.; Park, H.-W.; Park, D.-W. Appl. Surf. Sci. 2011, 257 (12), 5375–5379. (46) Hou, W. C.; Chen, L. Y.; Hong, F. C. N. Diam. Relat. Mater. 2008, 17 (7–10), 1780–1784.
(47) Lee, C. M.; Choi, S. I.; Choi, S. S.; Hong, S. H. Curr. Appl. Phys. 2006, 6 (2), 166–170.
(48) Oh, S.; Park, D. Korean J. Chem. Eng. 2000, 17 (3), 299–303.
(49) Kumar, S.; Kang, K.; Bae, G.; Selvarajan, V.; Lee, C. Mater. Chem. Phys. 2008, 112 (2), 436–441. (50) Im, J.-H.; Lee, J.-H.; Park, D.-W. Surf. Coatings Technol. 2008, 202 (22–23), 5471–5475.
(51) Kim, J. H.; Hong, Y. C.; Uhm, H. S. Surf. Coatings Technol. 2007, 201 (9–11 SPEC. ISS.), 5114– 5120.
(52) Hattori, Y.; Mukasa, S.; Toyota, H.; Inoue, T.; Nomura, S. Mater. Lett. 2011, 65 (2), 188–190. (53) Banerjee, I.; Karmakar, S.; Kulkarni, N. V.; Nawale, A. B.; Mathe, V. L.; Das, A. K.; Bhoraskar, S. V. J. Nanoparticle Res. 2010, 12 (2), 581–590.
(54) Chakravarty, U.; Naik, P. A.; Mukherjee, C.; Kumbhare, S. R.; Gupta, P. D. J. Appl. Phys. 2010, 108 (5).
(55) Noguez, C. J. Phys. Chem. C 2007, 111, 3806–3819.
(56) Tavares, J.; Swanson, E. J.; Coulombe, S. Plasma Process. Polym. 2008, 5 (8), 759–769.
(57) Tailleur, A.; Achour, A.; Djouadi, M. A.; Le Brizoual, L.; Gautron, E.; Tristant, P. Surf. Coatings Technol. 2012, 211, 18–23.
(58) Matsuura, T.; Taniguchi, K.; Watanabe, T. Thin Solid Films 2007, 515 (9), 4240–4246.
(59) Bystrzejewski, M.; Huczko, a.; Lange, H.; Płotczyk, W. W.; Stankiewicz, R.; Pichler, T.; Gemming, T.; Rümmeli, M. H. Appl. Phys. A 2008, 91 (2), 223–228.
(60) Okada, T.; Kaneko, T.; Hatakeyama, R. Thin Solid Films 2007, 515 (9), 4262–4265.
(61) Lu, F. K.; Roseberry, C. M.; Meyers, J. M.; Wilson, D. R.; Lee, Y. M.; Czysz, P. a; Student, D. C.; Karman, V.; Engineer-, A.; Member, S. Reactions 2004, No. January 1–7.
(62) Fabry, F.; Flamant, G.; Fulcheri, L. Chem. Eng. Sci. 2001, 56 (6), 2123–2132.
(63) Baldissarelli, V. Z.; Cassini, F. A.; Souza, I. G. De; Debacher, N. A. J. Braz. Chem. Soc. 2014, 25 (1), 126–132.
(64) Belmonte, T.; Arnoult, G.; Henrion, G.; Gries, T. J. Phys. D. Appl. Phys. 2011, 44 (36), 363001. (65) Eden, J. G.; Park, S.-J. Plasma Phys. Control. Fusion 2005, 47 (12B), B83–B92.
(66) Foest, R.; Schmidt, M.; Becker, K. Int. J. Mass Spectrom. 2006, 248 (3), 87–102.
(67) Iza, F.; Kim, G. J.; Lee, S. M.; Lee, J. K.; Walsh, J. L.; Zhang, Y. T.; Kong, M. G. Plasma Process. Polym. 2008, 5 (4), 322–344.
(68) Seto, T.; Kwon, S. B.; Hirasawa, M.; Yabe, A. Japanese J. Appl. Physics, Part 1 Regul. Pap. Short Notes Rev. Pap. 2005, 44 (7 A), 5206–5210.
(69) Shimizu, K.; Fukunaga, H.; Tatematsu, S.; Blajan, M. pn. J. Appl. Phys. 2012, 51 (11 PART2). (70) Shimizu, K.; Fukunaga, H.; Blajan, M. Curr. Appl. Phys. 2014, 14 (SUPPL. 2), S154–S161.
(71) Wei-Hung Chiang, Mohammed Sakr, X. P. A. G. and R. M. S. ACS Nano 2009, 3 (12), 4023–4032.
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